Three third generation semiconductor related projects have been landed, started, and put into operation
Since the beginning of this year, the construction of third-generation semiconductor related projects in various parts of China has been in full swing, echoing the growing demand in the end market. Recently, three major projects have been launched, started, and put into operation, involving fields such as RF and
SiC silicon carbide.http://www.ic-bom.com/
01 Han Tianxia 1.4 Billion RMB RF Module Project Signed and Settled in Huzhou, Zhejiang
According to reports, on May 18th, the launch and signing ceremony of the "415X" Advanced Manufacturing Special Fund Group in Zhejiang Province was held. At the meeting, the RF module project of Suzhou Hantianxia Electronics Co., Ltd. (hereinafter referred to as Hantianxia) was successfully signed.
According to the news from Huzhou Industry Group, Hantianxia RF module project has a total investment of 1.4 billion yuan. It plans to produce 264 million mobile terminals and vehicle scale RF modules annually, with a land area of about 49 mu. It will build a whole process capability base with the integration of RF Filter design, manufacturing, sealing and testing. The project will produce an output value of about 2 billion yuan/year after reaching its production capacity.http://www.ic-bom.com/
Hantianxia is one of the main suppliers of RF chips in China, focusing on the research and development, production, and sales of RF filters. It is reported that Hantianxia has conquered the key design and process technologies of BAW chips, and its products have also taken on a small scale in the market. As of April this year, Hantianxia has shipped over 250 million filters, making it one of the largest manufacturers of body sound wave filters in China.
At present, Hantianxia has launched 2.4GHz Wi Fi frequency band and 4G LTE B40 frequency band filters, B3 duplexers, B1+B3 multiplexers with different packaging sizes. Moreover, following the release of the first Wi Fi FEM module product, HSPM1224 (supporting Wi Fi 6) last year, Hanxia released a new Wi Fi FEM module product, HSPM1324, specifically designed for Wi Fi 7 (802.11be) systems, featuring high integration, high performance, miniaturization, and low cost.http://www.ic-bom.com/
02
Core Valley Microelectronics Microwave Devices and Modules Project Commences
According to reports, on May 18th, Hefei Xinyu Microelectronics Co., Ltd. (hereinafter referred to as Xinyu Microelectronics) held a commencement ceremony for the microwave device and module project.
It is reported that the project covers an area of 55 acres and a building area of 60000 square meters. The main construction content includes a microwave device production factory, a microwave module production factory, and other supporting projects. After completion, the project can form an annual production capacity of 6 million microwave chips, 6000 microwave modules, and T/R modules.
Xinyu Micro focuses on the research and development, design, production, and sales of semiconductor microwave millimeter wave chips, microwave modules, and T/R modules. It mainly provides a series of products based on GaAs and GaN compound semiconductor processes to the market, and provides technical development services around related products. At present, Xingu Micro is promoting its listing on the Science and Technology Innovation Board, and the Shanghai Stock Exchange has accepted its IPO application earlier this month.http://www.ic-bom.com/
In addition to the projects that have started recently, Xingu Micro plans to raise 850 million yuan for this listing to invest in microwave chip packaging and module industrialization projects, research and development center construction projects, and supplementary working capital. Among them, the microwave chip packaging and module industrialization project will further expand the production capacity of microwave chips, microwave modules, and T/R modules on the basis of the existing microwave millimeter wave chips, microwave modules, and T/R module products of Xinyu Micro.
03 Guangxin Micro High end Featured Process Power Semiconductor Wafer OEM Project Put into Production
On May 19th, the rooftop ceremony of Zhejiang Xinweitek Semiconductor Co., Ltd. (hereinafter referred to as "Xinweitek") factory and the connection ceremony of Zhejiang Guangxin Microelectronics Co., Ltd. (hereinafter referred to as "Guangxin Microelectronics") were held in the Zhejiang Xinweitek factory area.
MicroTek focuses on the research and development and production of semiconductor advanced power device ultra-thin chip backtrack technology, with an annual production and processing capacity of over 2.5 million wafers. The wafer size covers 6/8/12 inches, and the wafer types include silicon based (SILICON) devices and silicon carbide (SIC) devices.http://www.ic-bom.com/
Guangxin Microelectronics and the Guangxin Microproject started construction and piling in February 2022. The main factory building was capped in May, and the first equipment entered the site in December. The power supply was successfully closed in March 2023. It is reported that the total planned investment for this project is about 2.4 billion yuan. After all construction is completed and put into operation, it can achieve an annual production capacity of 2.4 million characteristic process silicon based power semiconductor wafers equivalent to 6 inches and 36000 third-generation semiconductor silicon carbide wafers, with an annual production value of 3 billion yuan.http://www.ic-bom.com/
