Recently, there has been new progress in the 12 inch integrated circuit production line project of Shenzhen Runpeng Semiconductor.http://www.ic-bom.com/

According to the official WeChat account of China Construction Third Engineering Bureau, the first raft foundation of the FAB main factory building of Runpeng Semiconductor 12-inch integrated circuit production line project, which was constructed by China Construction Third Engineering Bureau One Company, was successfully poured. This project is located in Bao‘an District, Shenzhen, with a total construction area of 238000 square meters. After completion, it will become an important 12 inch integrated circuit production line in the Guangdong Hong Kong Macao Greater Bay Area, filling the gaps in chip manufacturing in the Shenzhen area, and accelerating the achievement of independent innovation breakthroughs and commercial operations in key semiconductor fields and technologies.

It is understood that the total investment of the first phase of the project is 22 billion yuan, focusing on simulated characteristic processes above 40 nanometers. After the project is completed, the products will mainly be applied in fields such as automotive electronics, new energy, industrial control, and consumer electronics.

On October 28, 2022, China Resources Microelectronics announced that the construction entity of the China Resources Microelectronics Shenzhen 12 inch integrated circuit production line project is Runpeng Semiconductor (Shenzhen) Co., Ltd. The company is jointly funded and established in Shenzhen by China Resources Microelectronics holding subsidiary China Resources Micro Technology (Shenzhen) Co., Ltd. and local state-owned assets related legal persons in Shenzhen.http://www.ic-bom.com/

On May 5th, it was reported that the consortium of China Construction Third Engineering Bureau and a company won the EPC project for the 12 inch integrated circuit production line project of Guangdong Runpeng Semiconductor, with a winning amount of approximately 3.5 billion yuan.

The project is located in Bao‘an District, Shenzhen, with a total construction area of 238000 square meters and a total of 17 individual buildings. After the completion of the project, it will form a production capacity of 480000 12 inch power chips per year, fill the gaps in chip manufacturing in Shenzhen, and form a linkage and agglomeration effect with the upstream and downstream industries such as IC design, packaging, and testing. It will accelerate the realization of independent innovation breakthroughs and commercial operations in key semiconductor fields and technologies, and meet the huge market demand for semiconductor products in the high-speed economic development of the Greater Bay Area, Further enhance the core competitiveness of Guangdong‘s integrated circuit industry.

At present, semiconductor integrated circuits (ICs) rely on advanced process breakthroughs to achieve performance iteration, which is gradually slowing down, and the improvement of packaging forms is receiving more attention from the industry. Traditional packaging is transitioning towards advanced packaging such as FC, FIWLP, FOWLP, TSV, SIP, etc. Advanced packaging is expected to become the mainstream direction in the post Moore era.http://www.ic-bom.com/

Advanced packaging has advantages such as low manufacturing costs and low power consumption, which will bring value enhancement to multiple links in the industry chain. Taking chiplet technology as an example, through the deconstruction and reconstruction integration of chips, the entire value chain from upstream EDA, IP, design to downstream packaging and materials has been reshaped, bringing new technological challenges and market opportunities to multiple links. According to Yole data, the global packaging market size reached approximately $77.7 billion in 2021. Among them, the global market size of advanced packaging is about 35 billion US dollars, and it is expected that the global market size of advanced packaging will reach 47.5 billion US dollars by 2026.

Leading domestic and foreign seal testing companies such as Sunrise, Anqin, Changdian Technology, Tongfu Microelectronics, and Huatian Technology have laid out their chiplet business, with Intel, AMD, and Huawei actively participating. The main global suppliers of semiconductor packaging materials include companies such as Shinyue Chemical from Japan, Sumitomo Chemical, BASF from Germany, and DuPont from the United States, occupying major market shares. With the construction and operation of Fab factories in China, and the increasing requirements of advanced packaging processes for materials, there is huge potential for growth in the future IC packaging material market.http://www.ic-bom.com/