Electronic components are fundamental elements in electronic circuits and are essential in the composition of electronic products.

Ten key factors to consider when selecting components

1. Electrical characteristics: In addition to meeting the functional requirements of the equipment, components should be able to withstand the maximum applied electrical stress;

2. Operating temperature range: The rated operating temperature range of the component should be equal to or wider than the operating temperature range it needs to withstand;

3. Process quality and manufacturability: The component process is mature and stable, and the yield should be higher than the specified value. The packaging should be compatible with the equipment assembly process conditions;

4. Stability: Under changes in temperature, humidity, frequency, aging, etc., the parameter changes are within the allowable range;

5. Service life: The working or storage life should not be shorter than the expected lifespan of the equipment using them;

6. Environmental adaptability: It should be able to work well in various usage environments, especially in special environments such as hot and humid, salt mist, sand and dust, acid rain, mold, radiation, high altitude, etc;

7. Failure modes: There should be a thorough understanding of the typical failure modes and mechanisms of components;

8. Maintainability: Consideration should be given to the convenience of installation, disassembly, and replacement, as well as the required tools and proficiency level;

9. Availability: With more than one supplier, the supply cycle meets the equipment manufacturing schedule, and can ensure timely replacement of components in case of failure;

10. Cost: Considering the use of cost-effective components while meeting the required performance, lifespan, and environmental constraints simultaneously.

Suggestions for selecting key components

Analyze from signal quality, packaging, timing, and other aspects:

From the perspective of signal integrity analysis, analyze different devices with the same function, and under the same working conditions, based on simulated waveforms and different signal quality, provide optimal devices. For situations where there is only one device, signal waveforms under different conditions (high, low temperature, single load or multiple loads, etc.) can also be simulated, and interface performance can be analyzed to provide selection suggestions on whether the device meets system requirements.

If there are multiple packages for the same device, we should combine the current technical level of our supplier and the level of our production process to choose a PCB packaging form that is easy to design and implement, and provide selection suggestions.