On June 1, SMIC announced that it and its subsidiary, SMIC Pioneer, had signed the Investment Agreement of SMIC Pioneer Integrated Circuit Manufacturing (Shaoxing) Co., Ltd. with Shaoxing Binhai Xinrui Fund to invest in the construction of SMIC Shaoxing Phase III 12 inch wafer manufacturing pilot line project (planned to be completed this year), mainly producing IGBT, SJ and other power chips, HVIC (BCD) and other power driver chips.

The total investment of this project is 4.2 billion yuan, which is used to build a pilot test line that integrates research and development and monthly production of 10000 pieces of 12 inch integrated circuit characteristic process wafers for small-scale engineering, domestic verification, and production verification.http://www.ic-bom.com/

Shaoxing has released a message stating that it has formed a relatively complete integrated circuit industry chain, with an industrial scale exceeding 50 billion yuan in 2022.

Previously, semiconductor integrated circuits (ICs) relied on advanced manufacturing processes to achieve performance iteration, which gradually slowed down. The improvement of packaging forms has attracted more attention from the industry. Traditional packaging is transitioning towards advanced packaging such as FC, FIWLP, FOWLP, TSV, SIP, etc. Advanced packaging is expected to become the mainstream direction in the post Moore era.http://www.ic-bom.com/

Advanced packaging has advantages such as low manufacturing costs and low power consumption, which will bring value enhancement to multiple links in the industry chain. Taking chiplet technology as an example, through the deconstruction and reconstruction integration of chips, the entire value chain from upstream EDA, IP, design to downstream packaging and materials has been reshaped, bringing new technological challenges and market opportunities to multiple links. According to Yole data, the global packaging market size reached approximately $77.7 billion in 2021. Among them, the global market size of advanced packaging is about 35 billion US dollars, and it is expected that the global market size of advanced packaging will reach 47.5 billion US dollars by 2026.

Leading domestic and foreign seal testing companies such as Sunrise, Anqin, Changdian Technology, Tongfu Microelectronics, and Huatian Technology have laid out their chiplet business, with Intel, AMD, and Huawei actively participating. The main suppliers of semiconductor packaging materials in the world include Shin Yo Chemical, Sumitomo Chemical, BASF, DuPont and other companies, occupying major market shares. With the construction and operation of Fab factories in China, and the increasing requirements of advanced packaging processes for materials, there is huge potential for growth in the future IC packaging material market.http://www.ic-bom.com/